Ceramic fibers were functionalized by the sputter coating of copper in this study. The surface and interface structures of the functionalized ceramic fibers were investigated by atomic force microscopy (AFM) and environmental scanning electron microscopy (ESEM). The observations by AFM revealed the formation of nanoclusters on the fiber surface.
The coated layer of the sputtered copper was also confirmed by the ESEM examination, equipped with an energy-dispersive X-ray analysis. It was also found that the electrical resistance of the ceramic fibers decreased with increased coating thickness. The interfacial bonding between fibrous substrate and sputter-coated copper was investigated and discussed by peel-off tests in this study. The mechanism of the interfacial adhesion between copper and fiber substrate
was also discussed