In this study, melt-blown polypropylene (PP) nonwovens were used as substrates for the metallic deposition of copper. The substrates were pretreated by O2 plasma, followed by treatments such as sensitization,activation, and reduction. The effects of the copper sulfate concentration, reaction temperature, and plasma power on the conductivity and adhesion strength of the PP nonwovens were investigated after copper deposition. The morphology of the PP nonwovens after copper deposition,analyzed by scanning electron microscopy and atomic force microscopy, revealed that copper nanoclusters were deposited on the fiber surface with a smooth surface morphology and dense structure. X-ray photoelectron spectroscopy indicated that the copper was present mainly in the form of the elementary substance, which coexisted with a little Cu2